环氧树脂粘接胶系列 快固化型底部填充胶H907-U（中英文对照）

一、产品简介（Product Introduction）

H907-U是一种单组分环氧密封粘接剂，用于CSP或BGA底部填充制程及各类电子元组件、温度敏感产品、摄像头模组等之粘接固定、密封保护等。它能形成一致和无缺陷的固化胶层，能有效降低由于硅芯片与基板之间的总体温度膨胀特性不匹配或外力造成的冲击，具有较低之膨胀性。受热时能快速固化。较低的粘度特性使得其能更好的进行底部填充、元件粘接及产品密封保护等。（English: H907-U is a one-component epoxy sealing adhesive, used for CSP or BGA underfill process, as well as bonding, fixing and sealing protection of various electronic components, temperature-sensitive products, camera modules, etc. It can form a consistent and defect-free cured adhesive layer, effectively reducing the impact caused by the mismatch of the overall thermal expansion characteristics between the silicon chip and the substrate or external forces, and has low expansibility. It cures quickly when heated. Its low viscosity characteristics enable it to better perform underfill, component bonding and product sealing protection.）

二、特性（Characteristics）

三、硬化条件（Curing Conditions）

1. 在 150℃ 固化时间约为5-10分钟（English: Curing time is about 5-10 minutes at 150℃）

2. 在 130℃ 固化时间约为10-20分钟（English: Curing time is about 10-20 minutes at 130℃）

注意：粘结部位可能需加热一定的时间以便能达到固化的温度。固化条件会因不同的装置而不同。（English: Note: The bonding area may need to be heated for a certain period of time to reach the curing temperature. Curing conditions may vary depending on different equipment.）

四、使用及注意（Usage and Precautions）

1. 本产品在室温下使用有较好的流动性，如果将基板预热到60℃，流动性将有提高。（English: This product has good fluidity when used at room temperature; if the substrate is preheated to 60℃, the fluidity will be improved.）

2. 建议使用“I”型或“L”型点胶方式,建议使用本资料中推荐的固化条件。（English: It is recommended to use "I" type or "L" type dispensing method, and it is recommended to use the curing conditions recommended in this document.）

3. 点胶部位应保持清洁、干燥；批量使用前应先小量试用以了解胶水固化要求及特性要求；（English: The dispensing area should be kept clean and dry; before mass use, try a small amount first to understand the glue curing requirements and characteristic requirements.）

4. 作业场所应保持阴凉通风，因个人体质及环境变化问题，个别人员在接触胶水后会出现过敏情况，对此建议对胶水易过敏的人员尽量少接触，其它人员也应作好相应防护；接触胶水后应及时用酒精或清水冲洗，情况严重的应及时就医；（English: The workplace should be kept cool and well-ventilated. Due to personal physical differences and environmental changes, some personnel may experience allergies after contacting the glue. It is recommended that personnel who are prone to allergies to the glue minimize contact, and other personnel should also take corresponding protective measures; rinse with alcohol or clean water in time after contacting the glue, and seek medical attention promptly if the situation is serious.）

5. 由于该产品是受热会发生反应的化学产品，因此环境温度对产品品质的影响很大，请将产品保存在低温环境中，以确保产品的稳定性及品质，如果未能低温保存，在使用过程中产品容易出现流胶或粘接强度下降的现象；（English: Since this product is a chemical product that reacts when heated, the ambient temperature has a great impact on product quality. Please store the product in a low-temperature environment to ensure product stability and quality. If low-temperature storage is not possible, the product is prone to glue flowing or decreased bonding strength during use.）

五、包装及储存（Packaging and Storage）

包装：50G，250G，500G，1KG； 储存：25℃ 15天，0-5℃ 3个月（English: Packaging: 50G, 250G, 500G, 1KG; Storage: 15 days at 25℃, 3 months at 0-5℃）