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H907-L环氧树脂热固化三防胶, 耐高温耐溶剂成型保护密封胶, 电子元器件防潮防腐蚀涂层

无溶剂型单组份环氧密封保护产品 H907-L(中英文对照)一、概说(Overview)H907-L是不含溶剂型单组份环氧树脂密封保护产品,具有低线膨胀系数及耐高温、抗冲击、耐震动,固化物透明度好、硬度高等特性。广泛应用于电子元器件及工艺品、礼品的粘接固定,对于金属、陶瓷、玻璃、纤维制品及硬质塑胶之间的封装粘接、三防保护、

  • 包装方式:

    1-5kg

  • 固化条件:

    加温固化

  • 粘度25℃:

    3000-6000 cps

产品介绍

无溶剂型单组份环氧密封保护产品 H907-L(中英文对照)

一、概说(Overview)

H907-L是不含溶剂型单组份环氧树脂密封保护产品,具有低线膨胀系数及耐高温、抗冲击、耐震动,固化物透明度好、硬度高等特性。广泛应用于电子元器件及工艺品、礼品的粘接固定,对于金属、陶瓷、玻璃、纤维制品及硬质塑胶之间的封装粘接、三防保护、防水绝缘,有优异的粘接强度及密封性能;较常用于电子元件如:线路板、PCB、电源板、线材、线圈、磁芯、非晶材料、碳纤维成型及其它材料表面披覆,也可自行加入其它材料作为成型产品使用。(此胶水时间长了可能会出现环氧树脂和其它成份分层的现象,建议每次使用前对胶体整体做充分的搅拌)(English: H907-L is a solvent-free one-component epoxy resin sealing and protection product, with low linear expansion coefficient, high temperature resistance, impact resistance, vibration resistance, good transparency of cured product and high hardness. It is widely used for bonding and fixing of electronic components, crafts and gifts. It has excellent bonding strength and sealing performance for packaging and bonding, three-proof protection, waterproof and insulation between metals, ceramics, glass, fiber products and hard plastics; it is more commonly used for surface coating of electronic components such as circuit boards, PCBs, power boards, wires, coils, magnetic cores, amorphous materials, carbon fiber molding and other materials, and can also be added with other materials to be used as molding products. (This glue may have stratification between epoxy resin and other components after a long time. It is recommended to fully stir the entire colloid before each use.))

二、外观及物性(Appearance and Physical Properties)

项目(Item)

参数(Parameter)

英文参数(English Parameter)

外观(Appearance)

流动液状体

Flowing liquid

颜色(Color)

固化前白色半透明,固化后为透明色

Semi-transparent white before curing, transparent after curing

比重(25℃)(Specific Gravity (25℃))

1.1-1.2

1.1-1.2

粘度(25℃)(Viscosity (25℃))

3000-6000 CPS

3000-6000 CPS

三、固化条件(Curing Conditions)

120℃ / 1-1.5小时(English: 120℃ for 1-1.5 hours)

四、固化物特性(Cured Product Properties)

项目(Item)

单位(Unit)

参数(Parameter)

英文参数(English Parameter)

硬度(Hardness)

Shore D

85-95

85-95 Shore D

体积电阻(Volume Resistance)

Ω-cm

5.5×10¹⁴

5.5×10¹⁴ Ω-cm

表面电阻(Surface Resistance)

Ω-cm

3.5×10¹³

3.5×10¹³ Ω-cm

耐温(Temperature Resistance)

130-150

130-150 ℃

绝缘破坏电压(Insulation Breakdown Voltage)

kv/mm

16

16 kv/mm

抗拉强度(Tensile Strength)

kg/mm²

5

5 kg/mm²

五、使用及注意(Usage and Precautions)

  1. 点胶部位应保持清洁、干燥;批量使用前应先小量试用以了解胶水固化要求及特性要求;本品长时间放置可能出现环氧树脂与其他成分分层现象,每次使用前务必对胶体整体进行充分搅拌。(English: The dispensing area should be kept clean and dry; before mass use, try a small amount first to understand the glue curing requirements and characteristic requirements; this product may have stratification between epoxy resin and other components after long-term placement, so be sure to fully stir the entire colloid before each use.)

  2. 作业场所应保持阴凉通风,因个人体质及环境变化问题,个别人员在接触胶水后会出现过敏情况,对此建议对胶水易过敏的人员尽量少接触,其它人员也应作好相应防护;接触胶水后应及时用酒精或清水冲洗,情况严重的应及时就医;(English: The workplace should be kept cool and well-ventilated. Due to personal physical differences and environmental changes, some personnel may experience allergies after contacting the glue. It is recommended that personnel who are prone to allergies to the glue minimize contact, and other personnel should also take corresponding protective measures; rinse with alcohol or clean water in time after contacting the glue, and seek medical attention promptly if the situation is serious.)

  3. 胶液为流动液状体,固化过程中受加热影响可能出现流动,建议根据产品形态调整摆放角度,确保粘接、披覆均匀,避免胶液流失。(English: The glue is a flowing liquid and may flow due to heating during curing. It is recommended to adjust the placement angle according to the product shape to ensure uniform bonding and coating and avoid glue loss.)

  4. 由于该产品是受热会发生反应的化学产品,因此环境温度对产品品质的影响很大,建议将产品妥善存放于阴凉干燥环境,避免高温、潮湿,以确保产品的稳定性及品质,若存放不当,可能出现粘度异常、分层加快等现象;(English: Since this product is a chemical product that reacts when heated, the ambient temperature has a great impact on product quality. It is recommended to store the product properly in a cool and dry environment, avoid high temperature and humidity, to ensure product stability and quality. Improper storage may lead to abnormal viscosity, accelerated stratification and other phenomena.)

  5. 存放于冰箱的胶水,放入前检查胶水包装桶盖是否盖严,建议将胶水倒置于冰箱中存放,以防止水气进入;用前须提前拿出胶水放于室温解冻8-12小时,解冻期间不能打开包装瓶盖,以免因瓶内外温度差而使胶水表面凝结水气,使用前须对胶水整桶进行充分搅拌(重点搅拌分层部分);未用完的胶水须密封好于室温存放,不要再次放入冰箱存放;开盖使用后的胶水建议在5天内用完为宜。(English: For glue stored in the refrigerator, check whether the lid of the glue packaging bucket is tightly closed before putting it in. It is recommended to store the glue upside down in the refrigerator to prevent moisture from entering; take out the glue in advance and thaw it at room temperature for 8-12 hours before use. Do not open the packaging lid during thawing to avoid moisture condensation on the glue surface due to the temperature difference inside and outside the bottle. Fully stir the entire bucket of glue (focus on stirring the stratified part) before use; the unused glue must be sealed and stored at room temperature, and should not be put into the refrigerator again; it is recommended to use up the glue within 5 days after opening the lid.)

  6. 胶水在使用过程中若感觉胶水较浓,不好操作,切记不可自行添加稀释剂或其它化学溶剂,可要求我司对胶水黏度进行调整。(English: If the glue feels too thick and difficult to operate during use, remember not to add diluents or other chemical solvents by yourself; you can request our company to adjust the glue viscosity.)

  7. 本品适用于表面披覆、封装粘接等场景,操作时需控制胶液用量,避免过多溢出;固化后为透明色,请注意避免胶液污染产品表面,影响外观。(English: This product is suitable for surface coating, packaging and bonding and other scenarios. It is necessary to control the amount of glue during operation to avoid excessive overflow; it is transparent after curing, so please avoid glue contaminating the product surface and affecting the appearance.)


技术参数

型号

核心特点

配比

固化条件

H907

常规单组份粘接,通用型,不流动,高硬度高强度高粘接力,耐高温

120 度 1-1.5 小时

H907-HF

低卤粘接,低总氯含量,特性同H907,磁性元器件粘接固定

120 度 1-1.5 小时

H907-H

UL 130度认证,特性同H907,磁性元件、集成电路元件固定

120 度 1-1.5 小时

H907-T

透明粘接,固化后半透明,特性同H907,电子电器线路板元件粘接

120 度 1-1.5 小时

H907-TR

透明软性,固化后半透明,固化物柔韧,硬度60D左右,线路板元件粘接

120 度 1-1.5 小时

H907-HF-1

磁芯功能面专用,低粘度,高细腻度,粘接力强,耐高温

120 度 1-1.5 小时

H907-HF-1D

磁芯功能面导磁胶,磁芯边柱功能面专用,低粘度,高细腻度,提升稳定电感量

120 度 1-1.5 小时

H907-HF-N

磁芯中柱胶,磁芯中心柱填充专用,固化硬度40-50D,对磁芯影响小

120 度 1.5-2 小时

H907-HF-Z

磁芯中柱胶,磁芯中心柱填充专用,固化硬度45-55D,对磁芯影响小

120 度 1.5-2 小时

H907-HF-D

磁芯中柱胶,磁芯中心柱填充专用,固化硬度65-78D,对磁芯影响小

120 度 1.5-2 小时

H907-HF-G

低应力,变压器磁芯及骨架粘接,应力低,粘接力高,对磁芯影响小

120 度 1-1.5 小时

H907-HF-E

高强度粘接,高强度,耐高温,电子元件、磁芯粘接,可代替G500使用

120 度 1-1.5 小时

H907-HF-R

弹性粘接胶,通用型单组份弹性粘接胶,粘接力高,高弹性高伸缩率,硬度20-70D可调

120 度 1.5-2 小时

H907-HF-R1

弹性粘接胶,硬度60-70D,高强度粘接型柔性胶,PPS/PBT高附着力

120 度 1.5-2 小时

H907-HF-R3

弹性粘接胶,硬度30D,回弹性好,拉伸率高,低应力,高附着力

120 度 1-1.5 小时

H907-HF-RY

弹性哑光,硬度40-60D,固化物哑光,附着力强,磁芯粘接密封

120 度 1.5-2 小时

H907-RN

连接器密封,硬度50-60D,粘接强度高,气密封性,可过IPX8防水等级

150 度 1 小时

H907-TP-8

连接器密封,硬度大于80,强度高,TYPE-C防水密封,可过IPX8防水等级

150 度 30 分钟

H907-TP-1

连接器公头密封,硬度大于80,强度高,耐高温,TYPE-C公头粘接防水密封

120 度 1 小时

H907-K

低温快固化,80度快速固化,高强度高硬度,线路元件微电子粘接固定

80 度 30-60 分钟

H907-K-2

低温快固化,60度快速固化,高强度高硬度,线路元件微电子粘接固定

60 度 30-60 分钟

H907-KM

低温快固化,60度快速固化,适用于各类材料粘接,对塑料金属附着力强

60 度 30-60 分钟

H907-S

SMT贴片红胶,点胶刮胶方便,固化快,粘接力强,耐高温

130 度 5-10 分钟

H907-U

底部填充胶,各类芯片元件底部填充,流动性好,渗透性强,固化快速

130 度 10 分钟

H907-E

电感自动接脚,色码色环电感PIN针自动接脚,粘接强,固化快,耐锡焊

220 度 1.5 分钟

H907-Y

导电银胶,各类元件导电粘接,微电子粘接、电路修复等,导电性好

120 度 1-1.5 小时

H907-CU

铜系导电胶,各类元件导电粘接,电路修复等,导电性好、粘接力强,电阻小于1欧

120 度 1-1.5 小时

H907-C

碳系导电胶,变压器及各类元件导电粘接,电路修复等,导电性良好,电阻500-1000欧

120 度 1-1.5 小时

H907-C-2

手机快充专用,快充变压器导电粘接专用,不流动,成型性好,导电性良好,电阻200欧

120 度 1-1.5 小时

H907-GH

耐高温粘接,较常规单组份耐温更高,硬度高,耐温180-220度可调整

120 度 1-1.5 小时

H907-DH

单组份导热,具有较好导热性(导热性1.0-2.0可调),粘接力高,高硬度,高强度

120 度 1-1.5 小时

H907-DE

单组份导热,具有较高导热性(导热性2.0-4.0可调),粘接力高,高硬度,高强度

120 度 1-1.5 小时

H907-M

通用导磁胶,通用型,各类磁性元件粘接导磁及电子器件磁屏蔽用途

120 度 1-1.5 小时

H907-MH

高导磁率,导磁率10-40可调整,可调流动性,低粘度高硬度高强度

120 度 1-1.5 小时

H907-NR

NR电感导磁胶,NR电感专用,可提升电感量15-20%,软硬度可按需调节

120 度 1-1.5 小时

H907-GE

高强度粘接,对铝、钢、PBT、PPS等金属塑料均具有较高的粘接强度

120 度 1-1.5 小时

H907-MC

电磁感应固化,电机及电子电器粘接,可电磁感应快速固化

电磁感应 40-60 秒

H907-NW

快固化低收缩,高强度高硬度耐高温,电子元件、芯片等粘接,低膨胀系数

100 度 3-5 分钟

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